10 layer HDI4 order + PCB production + component purchasing + SMT + DIP processing,SMT PCB Service smt pcb assembly
Product Description
- 10-layer automotive product PCBA
- 10 layer HDI4 order + PCB production + component purchasing + SMT + DIP processing
- Packing requirements: vacuum packaging, electrostatic film, plastic box (optional one,
- blister box packaging requires additional billing + carton packaging)
- Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.
One stop services
- PCB layout
- Electronic design
- Engineering
- PCB fabrication
- PCB Assembly
- Box Build
- IC Programming
- Testing
- Parts sourcing
- Supply management
- After sales servies et
PCB capability and services
1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
PCB Assembly services
- SMT Assembly
- Automatic Pick & Place
- Component Placement as Small as 0201
- Fine Pitch QEP - BGA
- Automatic Optical Inspection
PCB, FPC process production capability
| Technical ltem |
MassProduct |
Advanced Technology |
| 2016 |
2017 |
2018 |
| Max.Layer Count |
26L |
36L |
80L |
| Through-hole plate |
2～45L |
2～60L |
2～80L |
| Max.PCBSize(in) |
24*52" |
25*62" |
25*78.75" |
| The layer number of FPC |
1～36L |
1～50L |
1～60L |
| Max.PCBSize(in) |
9.8"*196" |
9.8"*196" |
10"*196"Reel to reel |
| Layeredplatelayer |
2～12L |
2～18L |
2～26L |
| Max.PCBSize(in) |
9"*48" |
9"*52" |
9"*62" |
| Combination of hard and soft layers |
3～26L |
3～30L |
3～50L |
| Interconnect HDI |
5+X+5Interconnect HDI |
7+X+7Interconnect HDI |
8+X+8,Interconnect HDI |
| HDI PCB |
4～45L |
4～60L |
4～80L |
| Interconnect HDI |
3+20+3 |
4+X+4Interconnect HDI |
4+X+4,Interconnect HDI |
| Max.PCBSize(in) |
24"*43" |
24"*49" |
25"*52" |
| Material |
FR-4 Rogers |
FR-4 Rogers |
FR-4 Rogers |
| Base material |
Halogenfree,LowDK |
Halogenfree,LowDK |
Halogenfree,LowDK |
| Build-up Material |
FR-4 |
FR-4 |
FR-4 |
| BOard,Thickness(mm) |
Min.12L(mm) |
0.43 |
0.42～8.0mm |
0.38～10.0mm |
| Min.16L(mm) |
0.53 |
1.60～8.0mm |
0.45～10.0mm |
| Min.18L(mm) |
0.63 |
2.0～8.0 |
0.51～10.0mm |
| Min.52L(mm) |
0.8 |
2.50～8.0mm |
0.65～10.0mm |
| MAX(mm) |
3.5 |
10.0mm |
10.0mm |
| Min.CoreThickness um(mil) |
254"(10.0) |
254"(10.0) |
0.10～254(10.0mm) |
| Min.Build up Dielectric |
38(1.5) |
32(1.3) |
25(1.0) |
| BaseCopperWeight |
Inner Layer |
4/1-8 OZ |
4/1-15 OZ |
4/1-0.30mm |
| Out Layer |
4/1-10 OZ |
4/1-15 OZ |
4/1-30 OZ |
| Gold thick |
1～40u" |
1～60u" |
1～120u" |
| Nithick |
76～127u" |
76～200u" |
1～250u" |
| Min.HOle/Land um(mil) |
150/300(6/12) |
100/200(4/8) |
100/200(4/8) |
| Min.Laser via/landum(mil) |
60/170(2.4/6.8) |
50/150(2/6) |
50/150(2/6) |
| Min. IVH,Hole size/landum(mil) |
150/300(6/12) |
100/200(4/8) |
100/200(4/8) |
| DieletricThickness |
38(1.5) |
32(1.3) |
32(1.3) |
| 125(5) |
125(5) |
125(5) |
| SKipvia |
Yes |
Yes |
Yes |
| viaoNhie(laserviaon BuriedPTH) |
Yes |
Yes |
Yes |
| Laser Hole Filling |
Yes |
Yes |
Yes |
| Technicalltem |
Mass Product |
Advanced Technolgy |
| 2017year |
2018year |
2019year |
| Drill hole depth ratio |
ThroughHole |
2017year |
.40:1 |
.40:1 |
| Aspet Ratio |
Micro Via |
.35:1 |
1.2:1 |
1.2:1 |
| Copper Filling Dimple Size um(Mil) |
10(0.4) |
10(0.4) |
10(0.4) |
| Min.LineWidth＆space |
lnner Layer um(mil) |
45/45(1.8/1.8) |
38/38(1.5/1.5) |
38/38(1.5/1.5) |
| Plated Layer um(mil) |
45/45(1.8/1.8) |
38/38(1.5/1.5) |
38/38(1.5/1.5) |
| BGAPitch mm(Mil) |
0.3 |
0.3 |
0.3 |
| Min.PTH Hole ring um(mil) |
75(3mil) |
62.5(2.5mil) |
62.5(2.5mil) |
| Line Width Control |
∠2.5MIL |
±0.50 |
±0.50 |
±0.50 |
| 2.5Mil≤L/W∠4mil |
±0.50 |
±0.50 |
±0.50 |
| ≦3mil |
±0.60 |
±0.60 |
±0.60 |
| Laminated structure |
Layer by layer |
3+N+3 |
4+N+4 |
5+N+5 |
| Sequential Build-up |
20L Any Layer |
36L Any Layer |
52L Any Layer |
| Multi-layer overlay |
N+N |
N+N |
N+N |
| N+X+N |
N+X+N |
N+X+N |
| sequential Lamination |
2+(N+X+N)+2 |
2+(N+X+N)+2 |
2+(N+X+N)+2 |
| Soft and hard bonding |
2+(N+X+N)+2 |
2+(N+X+N)+2 |
2+(N+X+N)+2 |
| PTH filling process |
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole |
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole |
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole |
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design
Certificate:
IPC Standard
ISO9001
ISO/TS16949
UL
Testing and value added services:
AOI (Automatic optical inspection)
ICT(In-circuit test)
Reliability test
X-Ray Test
Analogue and digital function test
Firmware programming
Shipping Method and Payment terms:
1. By DHL, UPS, FedEx, TNT, or using clients account.
2. We suggest you using our DHL, UPS, FedEx, TNT forwarder for cost saving.
3. By sea for mass quantity according to customer's requirement.
4. By customer's Forwarder
6. T/T, West Union, etc.
Product Tags:
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Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG Images
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